Publication:
Thermal conductivity and diffusivity of Cu-Y alloys produced by different powder metallurgy routes

Thumbnail Image
Identifiers
URI: https://hdl.handle.net/10016/32761
ISSN: 0920-3796
DOI: https://doi.org/10.1016/j.fusengdes.2017.01.017
UXXI: AR/0000020907
Files
Thermal_FED_2017_ps.pdf (1.11 MB)
Publication date
2017-11
Defense date
Authors
Advisors
Tutors
Journal Title
Journal ISSN
Volume Title
Publisher
Elsevier
Impact
Google Scholar
Export
Research Projects
Organizational Units
Journal Issue
Abstract
Full density Cu-1%Y and Cu-0.8%Y alloys have been produced by different powder metallurgy routes and subsequent hot isostatic pressing. Some of the alloys have been subjected to equal channel angular pressing (ECAP) via BC route up to 8 passes. ECAP deformation homogenizes and refines the microstructure up to attaining a sub-micron grain structure. Thermal properties have been characterized by the laser flash method in the temperature range 373–773 K. The ECAP process, irrespective of the production route, enhanced the thermal conductivity to values similar to those for CuCrZr (ITER grade). The linear thermal expansion coefficient was temperature independent for all materials.
Description
Keywords
Copper, Yttrium, Thermal conductivity, ECAP, MA, Coefficient Thermal Expansion
Bibliographic citation
Carro, G., Muñoz, A., Monge, M., Savoini, B., Galatanu, A., Galatanu, M. & Pareja, R. (2017). Thermal conductivity and diffusivity of Cu-Y alloys produced by different powder metallurgy routes. Fusion Engineering and Design, vol. 124, pp. 1156–1160.
Collections
DF - GMNEM - Artículos de revistas