Publication: Study on the growth and properties of electrolessly deposited thin copper coatings on epoxy-based CFRP
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2020-03
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MDPI
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Abstract
In this study, copper coatings smaller than 3 µm were created by electroless deposition on epoxy-based carbon fiber-reinforced polymer (CFRP) laminates for enhancing their electrical properties. This well-known method of metallization was employed with a self-designed combination of reagents, and the coatings were studied to evaluate their physical and chemical properties. A five-stage plating strategy was applied to 40 mm × 40 mm samples, and three different coatings were produced during the work. The metal layers created were studied and characterized to evaluate their, electrical conductivity, thickness, and adhesion to substrates, among other properties. In addition, the growth mechanisms of the microstructure were analyzed in detail for a better understanding of the process. The results showed that the proposed metallization strategy presents good characteristics and is a strong candidate for enhancing the electrical performance of CFRP.
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This article belongs to the Special Issue Recent Advances in Nanostructured Polymer and Inorganic Coatings.
Keywords
Electrically conductive composites, Electroless copper, Functional epoxy CFRP, Lightning strike protection, Metallization, Metallization strategy
Bibliographic citation
de Juan, S., Gordo, E., Jiménez-Morales, A., & Sirois, F. (2020). Study on the Growth and Properties of Electrolessly Deposited Thin Copper Coatings on Epoxy-Based CFRP. Coatings, 10(3), 271.