Alibakhshikenari, MohammadVirdee, Bal SinghSalekzamankhani, ShahramBabaeian, FatemehAli, Syed MansoorIqbal, AmjadAl-Hasan, Muath2024-02-082024-02-082023-07-01International Journal of Electronics and Communications (AEÜ), (2023), 167, 1546841434-8411https://hdl.handle.net/10016/39964The paper presents a feasibility study on an innovative terahertz (THz) on-chip antenna array designed to reliably meet the high-performance connectivity requirements for next generation of wireless devices to enable bandwidth intensive applications, superfast fast streaming, bulk data exchange between internet of things (IoT) devices/smartphones and the development of holographic video conferencing. The significantly smaller wavelength of the THz-band and metasurface-inspired and artificial magnetic conductor (AMC) technologies are exploited here to realize an on-chip antenna. Several experimental on-chip antenna arrays of various matrix sizes were investigated for application at millimeter-wave/Terahertz RF front-end transceivers. The technique proposed here is shown to enhance the antennas impedance bandwidth, gain and radiation efficiency. Purely for experimental purposes a 2 × 24 radiation element array was fabricated. It exhibits an average measured gain of 20.36 dBi and radiation efficiency of 37.5% across 0.3-0.314 THz. For proof of the concept purposes a THz receiver incorporating the proposed on-chip antenna was modelled. The results show that with the proposed antenna array a THz receiver can provide a gain of 25 dB when the antenna is directly matched to low-noise amplifier stage.14eng© 2023 The Author(s). Published by Elsevier GmbH. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).Atribución-NoComercial-SinDerivadas 3.0 EspañaArtificial magnetic conductor (AMC) technologyElectronic devicesIntegrated circuit (IC)Low noise amplifier (LNA)Metasurface (MTS)Milimeter-waves (MM-Wave)Next Generation of wireless communicationsOn-Chip antenna arrayRF front-end transceiverTerahertz (THZ)research articleTelecomunicacioneshttps://doi.org/10.1016/j.aeue.2023.154684open accessAEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS167AR/0000033707