Vázquez García, María CarmenTapetado Moraleda, AlbertoOrcutt, J.Meng, H. C.Ram, R.2016-02-242016-02-242014-03Proc. SPIE 8990, Silicon Photonics IX (2014) pp. 89900A-89900A-70277-786Xhttps://hdl.handle.net/10016/22358The proceeding at: IX Conference Silicon Photonics, took place at 2014, March, 8 in S. Francisco (USA).Silicon is considered a promising platform for photonic integrated circuits as they can be fabricated in state-of-the-art electronics foundaries with integrated CMOS electronics. While much of the existing work on CMOS photonics has used directional couplers for power splitting, multimode interference (MMI) devices may have relaxed fabrication requirements and smaller footprints, potentially energy efficient designs. They have already been used as 1x2 splitters, 2x1 combiners in Quadrature Phase Shift Keying modulators, and 3-dB couplers among others. In this work, 3-dB, butterfly and cross MMI couplers are realized on bulk CMOS technology. Footprints from around 40um2 to 200 um2 are obtained. MMI tolerances to manufacturing process and bandwidth are analyzed and tested showing the robustness of the MMI devices.7application/pdfeng© 2014 SPIEPower efficiencyMultimode interference couplersSilicon photonicsManufacturing tolerancesCMOS photonicsPost-manufacturing trimmingIntegrated optic devices.Tolerance analysis for efficient MMI devices in silicon photonicsconference paperElectrónicaIngeniería Industrial10.1117/12.2039730open access89900A-189900A-7Proc. SPIE 8990, Silicon Photonics IX8990CC/0000024163