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Miniaturization trends in Substrate Integrated Waveguide (SIW) filters: A review

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dc.affiliation.dptoUC3M. Departamento de Teoría de la Señal y Comunicacioneses
dc.affiliation.grupoinvUC3M. Grupo de Investigación: Comunicacioneses
dc.contributor.authorIqbal, Amjad
dc.contributor.authorTiang, Jun Jiat
dc.contributor.authorWong, Sew Kin
dc.contributor.authorAlibakhshikenari, Mohammad
dc.contributor.authorFalcone, Francisco
dc.contributor.authorLimiti, Ernesto
dc.contributor.funderMinisterio de Ciencia, Innovación y Universidades (España)es
dc.date.accessioned2023-08-29T12:57:08Z
dc.date.available2023-08-29T12:57:08Z
dc.date.issued2020-12-11
dc.description.abstractThis review provides an overview of the technological advancements and miniaturization trends in Substrate Integrated Waveguide (SIW) filters. SIW is an emerging planar waveguide structure for the transmission of electromagnetic (EM) waves. SIW structure consists of two parallel copper plates which are connected by a series of vias or continuous perfect electric conductor (PEC) channels. SIW is a suitable choice for designing and developing the microwave and millimetre-wave (mm-Wave) radio frequency (RF) components: because it has compact dimensions, low insertion loss, high-quality factor (QF), and can easily integrate with planar RF components. SIW technology enjoys the advantages of the classical bulky waveguides in a planar structure; thus is a promising choice for microwave and mm-Wave RF components.en
dc.description.sponsorshipThis work was supported by the Ministerio de Ciencia, Innovación y Universidades, Gobierno de España under Grant RTI2018-095499-B-C31.en
dc.format.extent19
dc.identifier.bibliographicCitationIqbal, A., Tiang, J. J., Wong, S. K., Alibakhshikenari, M., Falcone, F., & Limiti, E. (2020). Miniaturization Trends in Substrate Integrated Waveguide (SIW) Filters: A review. IEEE Access, 8, 223287-223305.en
dc.identifier.doihttps://doi.org/10.1109/ACCESS.2020.3044088
dc.identifier.issn2169-3536
dc.identifier.publicationfirstpage223287
dc.identifier.publicationlastpage223305
dc.identifier.publicationtitleIEEE Accessen
dc.identifier.publicationvolume8
dc.identifier.urihttps://hdl.handle.net/10016/38140
dc.identifier.uxxiAR/0000028203
dc.language.isoengen
dc.publisherIEEEen
dc.relation.projectIDGobierno de España. RTI2018-095499-B-C31es
dc.rights© The Authors, 2020.en
dc.rightsAtribución 3.0 España*
dc.rights.accessRightsopen accessen
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/es/*
dc.subject.ecienciaElectrónicaes
dc.subject.ecienciaFísicaes
dc.subject.ecienciaIngeniería Mecánicaes
dc.subject.ecienciaTelecomunicacioneses
dc.subject.otherCoupling topologyen
dc.subject.otherFiltersen
dc.subject.otherIsolationen
dc.subject.otherMetallic viaen
dc.subject.otherSubstrate integrated waveguide (SIW)en
dc.subject.otherTransmission zero (TZ)en
dc.titleMiniaturization trends in Substrate Integrated Waveguide (SIW) filters: A reviewen
dc.typeresearch article*
dc.type.hasVersionVoR*
dspace.entity.typePublication
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